Vacuum packaged electromagnetic 2D scanning micromirror

Seung Han Chung; Seung Ki Lee; Chang Hyeon Ji; Jae Hyoung Park

doi:10.1016/j.sna.2019.03.021

Vacuum packaged electromagnetic 2D scanning micromirror

Seung Han Chung, Seung Ki Lee, Chang Hyeon Ji, Jae Hyoung Park

Electronic and Electrical Engineering

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19° at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1° at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 ± 0.85 Torr.

Original language	English
Pages (from-to)	147-155
Number of pages	9
Journal	Sensors and Actuators, A: Physical
Volume	290
DOIs	https://doi.org/10.1016/j.sna.2019.03.021
State	Published - 1 May 2019

Bibliographical note

Publisher Copyright:
© 2019 Elsevier B.V.

Keywords

Electromagnetic biaxial scanning micromirror
Vacuum packaging
Wafer-level packaging

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10.1016/j.sna.2019.03.021

Cite this

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title = "Vacuum packaged electromagnetic 2D scanning micromirror",

abstract = "We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19° at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1° at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 ± 0.85 Torr.",

keywords = "Electromagnetic biaxial scanning micromirror, Vacuum packaging, Wafer-level packaging",

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doi = "10.1016/j.sna.2019.03.021",

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T1 - Vacuum packaged electromagnetic 2D scanning micromirror

AU - Chung, Seung Han

AU - Lee, Seung Ki

AU - Ji, Chang Hyeon

AU - Park, Jae Hyoung

PY - 2019/5/1

Y1 - 2019/5/1

N2 - We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19° at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1° at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 ± 0.85 Torr.

AB - We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19° at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1° at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 ± 0.85 Torr.

KW - Electromagnetic biaxial scanning micromirror

KW - Vacuum packaging

KW - Wafer-level packaging

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DO - 10.1016/j.sna.2019.03.021

M3 - Article

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JO - Sensors and Actuators, A: Physical

JF - Sensors and Actuators, A: Physical

ER -

Vacuum packaged electromagnetic 2D scanning micromirror

Abstract

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Keywords

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