We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19° at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1° at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 ± 0.85 Torr.
- Electromagnetic biaxial scanning micromirror
- Vacuum packaging
- Wafer-level packaging