Topology Conversions of Non-Interpenetrated Metal-Organic Frameworks to Doubly Interpenetrated Metal-Organic Frameworks

Seok Jeong, Dongwook Kim, Jeongin Park, Sunyoung Shin, Hyehyun Kim, Gyoung Hwa Jeong, Dohyun Moon, Hoi Ri Moon, Myoung Soo Lah

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Non-interpenetrated three-dimensional (3D) metal-organic frameworks (MOFs) with both an interpenetration-favorable (3,5)-c hms topology and an interpenetration-unfavorable (3,5)-c gra topology are converted to doubly interpenetrated analogues with hms-c topology by thermal treatment, even in the absence of solvent. Depending on the conversion temperature and the properties of the pillaring ligand in the non-interpenetrated 3D MOF, which is based on two-dimensional sheets with 3-c hcb topology pillared by neutral ditopic linkers, the pillaring ligands in the interpenetrated MOFs produced are partially removed during the thermal conversions, leading to interpenetrated MOFs that simultaneously contain both micro- and mesopores.

Original languageEnglish
Pages (from-to)3899-3907
Number of pages9
JournalChemistry of Materials
Volume29
Issue number9
DOIs
StatePublished - 9 May 2017

Bibliographical note

Publisher Copyright:
© 2017 American Chemical Society.

Fingerprint

Dive into the research topics of 'Topology Conversions of Non-Interpenetrated Metal-Organic Frameworks to Doubly Interpenetrated Metal-Organic Frameworks'. Together they form a unique fingerprint.

Cite this