Non-interpenetrated three-dimensional (3D) metal-organic frameworks (MOFs) with both an interpenetration-favorable (3,5)-c hms topology and an interpenetration-unfavorable (3,5)-c gra topology are converted to doubly interpenetrated analogues with hms-c topology by thermal treatment, even in the absence of solvent. Depending on the conversion temperature and the properties of the pillaring ligand in the non-interpenetrated 3D MOF, which is based on two-dimensional sheets with 3-c hcb topology pillared by neutral ditopic linkers, the pillaring ligands in the interpenetrated MOFs produced are partially removed during the thermal conversions, leading to interpenetrated MOFs that simultaneously contain both micro- and mesopores.
Bibliographical noteFunding Information:
This work was supported by the NRF (2015R1A2A1A15053104, 2015R1D1A1A01056579 and 2016R1A5A1009405) through the National Research Foundation of Korea. The authors acknowledge PAL for beamline use (2015-first-2D-015 and 2015-second-2D-013).
© 2017 American Chemical Society.