To etch or not to etch

Simeon Trendafilov; Monica Allen; Yihuang Chen; Jeffery Allen; Cynthia Rivaldo Gomez; Young Jun Yoon; Zhiqun Lin

doi:10.1109/RAPID.2018.8509020

To etch or not to etch

Simeon Trendafilov, Monica Allen, Yihuang Chen, Jeffery Allen, Cynthia Rivaldo Gomez, Young Jun Yoon, Zhiqun Lin

Chemistry & Nanoscience

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Monocrystalline metallic nanoparticles are preferable for plasmonic applications, but grow preferably in polyhedral shapes which deviate from the pervasive spherical shape. Our simulations show that dimers of octahedral Au nanoparticles have higher field enhancement in the gap compared to dimers of spherical Au nanoparticles.

Original language	English
Title of host publication	RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	381-383
Number of pages	3
ISBN (Electronic)	9781538653494
DOIs	https://doi.org/10.1109/RAPID.2018.8509020
State	Published - 24 Oct 2018
Event	1st IEEE Research and Applications of Photonics In Defense Conference, RAPID 2018 - Mirimar Beach, United States Duration: 22 Aug 2018 → 24 Aug 2018

Publication series

Name	RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference

Conference

Conference	1st IEEE Research and Applications of Photonics In Defense Conference, RAPID 2018
Country/Territory	United States
City	Mirimar Beach
Period	22/08/18 → 24/08/18

Keywords

field enhancement
Monocrystalline Au octahedron
nanoparticle dimers
plasmonics

Access to Document

10.1109/RAPID.2018.8509020

Cite this

Trendafilov, S., Allen, M., Chen, Y., Allen, J., Gomez, C. R., Yoon, Y. J., & Lin, Z. (2018). To etch or not to etch. In RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference (pp. 381-383). Article 8509020 (RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RAPID.2018.8509020

@inproceedings{69934d5e108e4f3287bb1964b5efce34,

title = "To etch or not to etch",

abstract = "Monocrystalline metallic nanoparticles are preferable for plasmonic applications, but grow preferably in polyhedral shapes which deviate from the pervasive spherical shape. Our simulations show that dimers of octahedral Au nanoparticles have higher field enhancement in the gap compared to dimers of spherical Au nanoparticles.",

keywords = "field enhancement, Monocrystalline Au octahedron, nanoparticle dimers, plasmonics",

author = "Simeon Trendafilov and Monica Allen and Yihuang Chen and Jeffery Allen and Gomez, {Cynthia Rivaldo} and Yoon, {Young Jun} and Zhiqun Lin",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 1st IEEE Research and Applications of Photonics In Defense Conference, RAPID 2018 ; Conference date: 22-08-2018 Through 24-08-2018",

year = "2018",

month = oct,

day = "24",

doi = "10.1109/RAPID.2018.8509020",

language = "English",

series = "RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "381--383",

booktitle = "RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference",

}

Trendafilov, S, Allen, M, Chen, Y, Allen, J, Gomez, CR, Yoon, YJ & Lin, Z 2018, To etch or not to etch. in RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference., 8509020, RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference, Institute of Electrical and Electronics Engineers Inc., pp. 381-383, 1st IEEE Research and Applications of Photonics In Defense Conference, RAPID 2018, Mirimar Beach, United States, 22/08/18. https://doi.org/10.1109/RAPID.2018.8509020

To etch or not to etch. / Trendafilov, Simeon; Allen, Monica; Chen, Yihuang et al.
RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference. Institute of Electrical and Electronics Engineers Inc., 2018. p. 381-383 8509020 (RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - To etch or not to etch

AU - Trendafilov, Simeon

AU - Allen, Monica

AU - Chen, Yihuang

AU - Allen, Jeffery

AU - Gomez, Cynthia Rivaldo

AU - Yoon, Young Jun

AU - Lin, Zhiqun

PY - 2018/10/24

Y1 - 2018/10/24

N2 - Monocrystalline metallic nanoparticles are preferable for plasmonic applications, but grow preferably in polyhedral shapes which deviate from the pervasive spherical shape. Our simulations show that dimers of octahedral Au nanoparticles have higher field enhancement in the gap compared to dimers of spherical Au nanoparticles.

AB - Monocrystalline metallic nanoparticles are preferable for plasmonic applications, but grow preferably in polyhedral shapes which deviate from the pervasive spherical shape. Our simulations show that dimers of octahedral Au nanoparticles have higher field enhancement in the gap compared to dimers of spherical Au nanoparticles.

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KW - Monocrystalline Au octahedron

KW - nanoparticle dimers

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DO - 10.1109/RAPID.2018.8509020

M3 - Conference contribution

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T3 - RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference

SP - 381

EP - 383

BT - RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 1st IEEE Research and Applications of Photonics In Defense Conference, RAPID 2018

Y2 - 22 August 2018 through 24 August 2018

ER -

Trendafilov S, Allen M, Chen Y, Allen J, Gomez CR, Yoon YJ et al. To etch or not to etch. In RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference. Institute of Electrical and Electronics Engineers Inc. 2018. p. 381-383. 8509020. (RAPID 2018 - 2018 IEEE Research and Applications of Photonics In Defense Conference). doi: 10.1109/RAPID.2018.8509020

To etch or not to etch

Abstract

Publication series

Conference

Keywords

Access to Document

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Cite this