| Original language | English |
|---|---|
| Pages (from-to) | 16-19 |
| Number of pages | 4 |
| Journal | IEEE Nanotechnology Magazine |
| Volume | 3 |
| Issue number | 1 |
| DOIs | |
| State | Published - Mar 2009 |
Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies
Johan Liu, Teng Wang, Eleanor E.B. Campbell
Research output: Contribution to journal › Article › peer-review
3
Scopus
citations