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Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies

  • Johan Liu
  • , Teng Wang
  • , Eleanor E.B. Campbell

Research output: Contribution to journalArticlepeer-review

3 Scopus citations
Original languageEnglish
Pages (from-to)16-19
Number of pages4
JournalIEEE Nanotechnology Magazine
Volume3
Issue number1
DOIs
StatePublished - Mar 2009

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