Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies

Johan Liu; Teng Wang; Eleanor E.B. Campbell

doi:10.1109/MNANO.2009.932220

Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies

Johan Liu, Teng Wang, Eleanor E.B. Campbell

Department of Physics

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Original language	English
Pages (from-to)	16-19
Number of pages	4
Journal	IEEE Nanotechnology Magazine
Volume	3
Issue number	1
DOIs	https://doi.org/10.1109/MNANO.2009.932220
State	Published - Mar 2009

Access to Document

10.1109/MNANO.2009.932220

Cite this

@article{3cef1603b7e24f58b842593c2439b4fc,

title = "Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies",

author = "Johan Liu and Teng Wang and Campbell, {Eleanor E.B.}",

year = "2009",

month = mar,

doi = "10.1109/MNANO.2009.932220",

language = "English",

volume = "3",

pages = "16--19",

journal = "IEEE Nanotechnology Magazine",

issn = "1932-4510",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles: As power consumption increases, so does the need for more efficient heat removal technologies. / Liu, Johan; Wang, Teng; Campbell, Eleanor E.B.
In: IEEE Nanotechnology Magazine, Vol. 3, No. 1, 03.2009, p. 16-19.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Thermal Management Technologies for Electronics Based on Multiwalled Carbon Nanotube Bundles

T2 - As power consumption increases, so does the need for more efficient heat removal technologies

AU - Liu, Johan

AU - Wang, Teng

AU - Campbell, Eleanor E.B.

PY - 2009/3

Y1 - 2009/3

UR - http://www.scopus.com/inward/record.url?scp=65749120423&partnerID=8YFLogxK

U2 - 10.1109/MNANO.2009.932220

DO - 10.1109/MNANO.2009.932220

M3 - Article

AN - SCOPUS:65749120423

SN - 1932-4510

VL - 3

SP - 16

EP - 19

JO - IEEE Nanotechnology Magazine

JF - IEEE Nanotechnology Magazine

IS - 1

ER -