The electrical properties of gold nanoparticle assemblies linked by DNA

So Jung Park; Anne A. Lazarides; Chad A. Mirkin; Paul W. Brazis; Carl R. Kannewurf; Robert L. Letsinger

doi:10.1002/1521-3773(20001103)39:21<3845::AID-ANIE3845>3.0.CO;2-O

The electrical properties of gold nanoparticle assemblies linked by DNA

So Jung Park, Anne A. Lazarides, Chad A. Mirkin, Paul W. Brazis, Carl R. Kannewurf, Robert L. Letsinger

Department of Chemistry & Nanoscience

Research output: Contribution to journal › Article › peer-review

140 Scopus citations

Abstract

The semiconducting behavior of gold nanoparticle assemblies linked by DNA is independent of the length of the DNA linker over the range of 24 to 72 base pairs (see picture; n = 1-3). These studies indicate that the molecular recognition properties of DNA can be used to assemble nanoparticle-based materials without passivating them or destroying their discrete structural and electrical properties.

Original language	English
Pages (from-to)	3845-3848
Number of pages	4
Journal	Angewandte Chemie - International Edition
Volume	39
Issue number	21
DOIs	https://doi.org/10.1002/1521-3773(20001103)39:21<3845::AID-ANIE3845>3.0.CO;2-O
State	Published - 3 Nov 2000

Keywords

Colloids
Conducting materials
DNA structures
Gold
Small angle X-ray scattering

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10.1002/1521-3773(20001103)39:21<3845::AID-ANIE3845>3.0.CO;2-O

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AU - Mirkin, Chad A.

AU - Brazis, Paul W.

AU - Kannewurf, Carl R.

AU - Letsinger, Robert L.

PY - 2000/11/3

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AB - The semiconducting behavior of gold nanoparticle assemblies linked by DNA is independent of the length of the DNA linker over the range of 24 to 72 base pairs (see picture; n = 1-3). These studies indicate that the molecular recognition properties of DNA can be used to assemble nanoparticle-based materials without passivating them or destroying their discrete structural and electrical properties.

KW - Colloids

KW - Conducting materials

KW - DNA structures

KW - Gold

KW - Small angle X-ray scattering

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The electrical properties of gold nanoparticle assemblies linked by DNA

Abstract

Keywords

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