Abstract
We studied the effects of high-pressure annealing (HPA) on InGaZnO (IGZO) thin-film transistors (TFTs). HPA was proceeded after TFT fabrication as a post process to improve electrical performance and stability. We used N2 as the pressurized gas. The applied pressures were 1 and 3 MPa at 200 °C. For N2 HPA under 3 MPa at 200 °C, field-effect mobility and the threshold voltage shift under a positive bias temperature stress were improved by 3.31 to 8.82 cm2/(V s) and 8.90 to 4.50 V, respectively. The improved electrical performance and stability were due to structural relaxation by HPA, which leads to increased carrier concentration and decreased oxygen vacancy.
Original language | English |
---|---|
Pages (from-to) | 13496-13501 |
Number of pages | 6 |
Journal | ACS Applied Materials and Interfaces |
Volume | 6 |
Issue number | 16 |
DOIs | |
State | Published - 27 Aug 2014 |
Keywords
- InGaZnO
- high-pressure annealing
- oxide thin-film transistor
- post process
- thin-film transistor