Stress management in sub-90-nm transistor architecture

Engineering

• Tensile Stress σ 100%
• Tensiles 100%
• Dielectric Films 100%
• Nodes 50%
• Low-Temperature 50%
• Nitride 50%
• Performance Improvement 50%
• Shallow Trench Isolation 50%
• Compressive Stress 50%
• Additional Cost 50%
• Interlayer 50%
• Oxide Film 50%

Material Science

• Film 100%
• Transistor 100%
• Dielectric Films 100%
• Ultimate Tensile Strength 50%
• Nitride Compound 50%
• Oxide Film 50%