Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration

Xuehong Yu, Minsoo Kim, Florian Herrault, Chang Hyeon Ji, Jungkwun Kim, Mark G. Allen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

33 Scopus citations

Abstract

This paper presents a CMOS-compatible process for fabrication of 3D structures embedded in the volume of a silicon wafer, and capable of interconnection to circuitry on the wafer surface. The key challenge of embedding structures in the silicon substrate is processing inside deep silicon trenches. This difficulty is overcome by means of several key techniques: multilevel wafer etching; cavity shaping; fine proximity lithography at the bottom of trenches; and laminated dry-film lithography on complex 3D structures. As a technology demonstration, a topologically complex 3D toroidal inductor is fabricated in a deep silicon trench, and is coupled to the wafer surface with high-power, electroplated through-wafer interconnect. Inductors fabricated in these trenches achieved an overall inductance of 60 nH, dc resistance of 399 MΩ, and quality factor of 17.5 at 70 MHz.

Original languageEnglish
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages325-328
Number of pages4
DOIs
StatePublished - 2012
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
Duration: 29 Jan 20122 Feb 2012

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Country/TerritoryFrance
CityParis
Period29/01/122/02/12

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