Abstract
This paper investigates how gate height Hg, which refers to the size of a floating-body, affects the program efficiency and retention characteristics of one-transistor DRAM (1T-DRAM) and nonvolatile memory (NVM) for a FinFET SONOS device that has a partially depleted silicon-on-insulator (PDSOI) region as a charge storage node for a 1T-DRAM operation. A device with a lower Hg yields enhanced program efficiency due to the higher impact ionization rate caused by the enlarged PDSOI region for both 1T-DRAM and NVM operations. The device with the lower Hg shows slightly poor retention characteristics in the NVM unlike the 1T-DRAM.
Original language | English |
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Pages (from-to) | 601-608 |
Number of pages | 8 |
Journal | IEEE Transactions on Electron Devices |
Volume | 56 |
Issue number | 4 |
DOIs | |
State | Published - 2009 |
Keywords
- FinFET
- Gate height
- Nonvolatile memory
- One-transistor DRAM (1T-DRAM)
- Partially depleted silicon-on-insulator (PDSOI)
- SONOS
- Unified random access memory (URAM)