Prediction of multiple-feature effects in plasma etching

Gyeong S. Hwang, Konstantinos P. Giapis

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


Charging and topography evolution simulations during plasma etching of dense line-and-space patterns reveal that multiple-feature effects influence critically the etch profile characteristics of the various lines. By including neighboring lines, the simulation predicts a peculiar notching behavior, where the extent of notching varies with the location of the line. Feature-scale modeling can no longer be focused on individual features alone; "adjacency" effects are crucial for understanding and predicting the outcome of etching experiments at reduced device dimensions.

Original languageEnglish
Pages (from-to)2377-2379
Number of pages3
JournalApplied Physics Letters
Issue number18
StatePublished - 5 May 1997


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