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Parylene-insulated ultradense microfabricated coils
Florian Herrault
, Svyatoslav Yorish
, Thomas M. Crittenden
,
Chang Hyeon Ji
, Mark G. Allen
Electronic and Electrical Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
17
Scopus citations
Overview
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Engineering
Packing Density
100%
Mm Diameter
50%
Fabrication Approach
50%
Microfabrication
50%
Photoresist
50%
Test Structure
50%
Actuator
50%
Aspect Ratio
50%
Material Science
Density
100%
Conductor
66%
Electroplating
33%
Actuator
33%
Device Integration
33%
Microfabrication
33%