Oxynitride Amorphous Carbon Layer for Electrically and Thermally Robust Bipolar Resistive Switching

Sun Hwa Min, Da Seul Hyeon, Gabriel Jang, Jisoo Choi, Jeongwoo Seo, Soyeong Kwon, Dong Wook Kim, Jin Pyo Hong

Research output: Contribution to journalArticlepeer-review

Abstract

Advanced resistive random-access memory (ReRAM) devices based on resistive switching (RS) have been intensely studied for future high-density nonvolatile memory devices owing to their high scalability, simplified integration, fast operation, and ultralow power consumption. Among the recently considered active media, diverse carbon-based media have emerged because of numerous benefits of simple chemical composition, desirable speed, and cost-effective scalability. However, these media are still susceptible to undesirable reliability issues, including poor endurance and retention and uncontrollable operation voltage distribution. In this study, an oxynitride amorphous carbon active medium governed by appropriate nitrogen content during growth is introduced to facilitate high electrical stability, such as a distinct pulse endurance of more than 107 cycles, a high retention time of 105 s at 85 °C, and increased uniformity in the SET/RESET distribution with thermally robust RS stability even at a high annealing temperature of 400 °C. The findings are possibly the result of adapting an sp2–sp3 conversion nature assisted by the presence of pyridinic N or pyrrolic N as a substitution reaction.

Original languageEnglish
Article number2201090
JournalAdvanced Electronic Materials
Volume9
Issue number3
DOIs
StatePublished - Mar 2023

Bibliographical note

Funding Information:
S.M. and D.S.H. contributed equally to this work. This research was supported by the National Research Foundation of Korea (NRF) (NRF‐2021M3F3A2A01037750).

Publisher Copyright:
© 2023 The Authors. Advanced Electronic Materials published by Wiley-VCH GmbH.

Keywords

  • off-axis reactive sputtering
  • oxynitride amorphous carbon layer
  • pyridinic-nitrogen bonds
  • pyrrolic-nitrogen bonds
  • sp bond conductive filaments

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