Abstract
A new structural concept for submicron MOSFETs is described for substantially suppressing adverse hot carrier effects. This structure differs from the well known LDD type of structure in that it has a more lightly doped N-type region located behind a very shallow, steeply profiled source/drain junction.
| Original language | English |
|---|---|
| Pages (from-to) | 39-41 |
| Number of pages | 3 |
| Journal | Electronics Letters |
| Volume | 26 |
| Issue number | 1 |
| DOIs | |
| State | Published - 1990 |
Keywords
- FETs
- Integrated circuits
- MOS structures and devices
- Semiconductor devices and materials