Abstract
A new structural concept for submicron MOSFETs is described for substantially suppressing adverse hot carrier effects. This structure differs from the well known LDD type of structure in that it has a more lightly doped N-type region located behind a very shallow, steeply profiled source/drain junction.
Original language | English |
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Pages (from-to) | 39-41 |
Number of pages | 3 |
Journal | Electronics Letters |
Volume | 26 |
Issue number | 1 |
DOIs | |
State | Published - 1990 |
Keywords
- FETs
- Integrated circuits
- MOS structures and devices
- Semiconductor devices and materials