Micro projection lithography inside deep trenches using microlens on a mask

Chang Hyeon Ji, Florian Herrault, Mark G. Allen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper presents a micro projection lithography process which enables the patterning of photoresist at the bottom surface of deep cavities, using microlenses formed directly on the mask. Arrays of cylindrical plano-convex microlenses on conventional photomasks have been fabricated by a photoresist melting and reflow technique, thereby augmenting the proximity lithography performance of these masks. Patterning results inside deep trenches have been analyzed. A maximum pattern width reduction of 64% for a 60μm rectangular pattern at the bottom of a 216μm-deep trench has been achieved with a microlens with a focal length of 267μm. The effect of the focal length variation on the pattern size variation has been analyzed.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages1908-1911
Number of pages4
DOIs
StatePublished - 2009
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 21 Jun 200925 Jun 2009

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/TerritoryUnited States
CityDenver, CO
Period21/06/0925/06/09

Keywords

  • Microlens
  • Projection lithography
  • Three-dimensional packaging

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