Machining characteristics of glass substrates containing chemical components in femtosecond laser helical drilling

Hyeon Min Lee, Jung Hyun Choi, Seung Jae Moon

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

The machining characteristics of glass substrates containing chemical components were investigated for the purpose of femtosecond laser helical drilling. A femtosecond laser of wavelength 1552 nm and pulse duration 800 fs was adopted in the laser machining system. The substrates investigated were aluminosilicate, soda-lime, and borosilicate glass. The chemical components contained in each glass substrate were quantitatively analyzed by laser ablation-induced chemical plasma mass spectrometry. The characteristics of the drilling conditions for each glass substrate were affected by its chemical components. As the wt% of Al2O3 and MgO components in the glass substrates increased, the ablation threshold energy of each substrate decreased, resulting in greater vertical speed of the laser head.

Original languageEnglish
Pages (from-to)375-385
Number of pages11
JournalInternational Journal of Precision Engineering and Manufacturing - Green Technology
Volume8
Issue number2
DOIs
StatePublished - Mar 2021

Keywords

  • Femtosecond laser
  • Glass
  • Glass chemicals
  • Helical drilling

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