Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jönsson, Goo Hwan Jeong, Eleanor E.B. Campbell, Johan Liu

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This letter demonstrates the transfer and formation of aligned carbon nanotube (CNT) arrays at low temperature by imprinted conductive adhesive. A thermoplastic isotropic conductive adhesive is patterned by an imprint and heat transfer process. The CNTs grown by thermal chemical vapor deposition are then transferred to another substrate by the conductive adhesive, forming predefined patterns. The current-voltage response of the transferred CNT bundles verifies that good electrical connection has been established. This process can enable the integration of CNTs into various temperature-sensitive processeses and materials.

Original languageEnglish
Article number093123
JournalApplied Physics Letters
Issue number9
StatePublished - 2007

Bibliographical note

Funding Information:
The authors thank Micro Joining KB for kindly providing the conductive adhesive used in this work. Three of the authors (T.W., B.C., and J.L.) are grateful to the financial support from EC-GEPRO project under the Contract No. of SSA 033349. One of the authors was (J.L.) also grateful to the support of Shanghai Science and Technology under the Pu Jiang Program (05PJ14045) and to the support of Intel under the higher education program with the Contract No. CNDA 4126007. Two of the authors (E.E.B.C. and M.J.) acknowledge financial support from the Swedish Strategic Research Foundation via the CARAMEL Materials Research Consortium.


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