Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

Sang Hyun Park, Sung Min Park, Hyo Hoon Park, Chul Soon Park

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

A 10-Gb/s optical receiver array with low interchannel crosstalk is realized by exploiting an InGaP-GaAs heterojunction bipolar transistor technology in a three-dimensional multilayer low-temperature cofiring ceramics (LTCC) module. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high-frequency crosstalk from on-chip bus and intermetallic capacitance. This module demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module with 0.8-dB power penalty.

Original languageEnglish
Pages (from-to)1516-1518
Number of pages3
JournalIEEE Photonics Technology Letters
Volume17
Issue number7
DOIs
StatePublished - Jul 2005

Keywords

  • Channel crosstalk
  • Flip-chip
  • Low-temperature cofiring ceramic (LTCC) substrate
  • Parallel optical interconnects
  • Transimpedance amplifier

Fingerprint

Dive into the research topics of 'Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects'. Together they form a unique fingerprint.

Cite this