Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

Sang Hyun Park; Sung Min Park; Hyo Hoon Park; Chul Soon Park

doi:10.1109/LPT.2005.848562

Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

Sang Hyun Park, Sung Min Park, Hyo Hoon Park, Chul Soon Park

Electronic and Electrical Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

A 10-Gb/s optical receiver array with low interchannel crosstalk is realized by exploiting an InGaP-GaAs heterojunction bipolar transistor technology in a three-dimensional multilayer low-temperature cofiring ceramics (LTCC) module. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high-frequency crosstalk from on-chip bus and intermetallic capacitance. This module demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module with 0.8-dB power penalty.

Original language	English
Pages (from-to)	1516-1518
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	17
Issue number	7
DOIs	https://doi.org/10.1109/LPT.2005.848562
State	Published - Jul 2005

Bibliographical note

Funding Information:
Manuscript received January 27, 2005; revised March 9, 2005. This work was supported in part by the Ministry of Science and Technology of Korea and by the Korea Institute of Science and Technology Evaluation and Planning (KISTEP). S. H. Park, H.-H. Park, and C. S. Park are with the School of Engineering, Information and Communications University, Daejeon 305-714, Korea (e-mail: [email protected]). S. M. Park is with the Department of Information Electronics Engineering, Ewha Womans University, Seoul 120-750, Korea (e-mail: [email protected]). Digital Object Identifier 10.1109/LPT.2005.848562 Fig. 1. (a) Block diagram of a single channel receiver, where C is the off-chip balancing capacitor and (b) schematic diagram of the NG stage using C of Q asC .

Keywords

Channel crosstalk
Flip-chip
Low-temperature cofiring ceramic (LTCC) substrate
Parallel optical interconnects
Transimpedance amplifier

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abstract = "A 10-Gb/s optical receiver array with low interchannel crosstalk is realized by exploiting an InGaP-GaAs heterojunction bipolar transistor technology in a three-dimensional multilayer low-temperature cofiring ceramics (LTCC) module. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high-frequency crosstalk from on-chip bus and intermetallic capacitance. This module demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module with 0.8-dB power penalty.",

keywords = "Channel crosstalk, Flip-chip, Low-temperature cofiring ceramic (LTCC) substrate, Parallel optical interconnects, Transimpedance amplifier",

author = "Park, {Sang Hyun} and Park, {Sung Min} and Park, {Hyo Hoon} and Park, {Chul Soon}",

note = "Funding Information: Manuscript received January 27, 2005; revised March 9, 2005. This work was supported in part by the Ministry of Science and Technology of Korea and by the Korea Institute of Science and Technology Evaluation and Planning (KISTEP). S. H. Park, H.-H. Park, and C. S. Park are with the School of Engineering, Information and Communications University, Daejeon 305-714, Korea (e-mail: [email protected]). S. M. Park is with the Department of Information Electronics Engineering, Ewha Womans University, Seoul 120-750, Korea (e-mail: [email protected]). Digital Object Identifier 10.1109/LPT.2005.848562 Fig. 1. (a) Block diagram of a single channel receiver, where C is the off-chip balancing capacitor and (b) schematic diagram of the NG stage using C of Q asC .",

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AB - A 10-Gb/s optical receiver array with low interchannel crosstalk is realized by exploiting an InGaP-GaAs heterojunction bipolar transistor technology in a three-dimensional multilayer low-temperature cofiring ceramics (LTCC) module. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high-frequency crosstalk from on-chip bus and intermetallic capacitance. This module demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module with 0.8-dB power penalty.

KW - Channel crosstalk

KW - Flip-chip

KW - Low-temperature cofiring ceramic (LTCC) substrate

KW - Parallel optical interconnects

KW - Transimpedance amplifier

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Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

Abstract

Bibliographical note

Keywords

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