Highly stable Cu doped SnO2/TiO2 photocatalyst enables selective 3e ORR-driven •OH generation for robust GenX removal

  • Seok Byum Jang
  • , Choe Earn Choong
  • , Kien Tiek Wong
  • , So Yeon Yoon
  • , Yeomin Yoon
  • , Min Jang

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

In this study, the photocatalytic degradation efficiencies of GenX using SnO2/TiO2 composites and their Cu-doped counterparts were investigated. Although SnO2 and TiO2 separately exhibited limited GenX removal, the SnO2/TiO2 composite demonstrated significantly enhanced activity, which was further boosted by aeration. Cu doping at 2 wt% [Cu(2 %)-SnO2/TiO2] magnified the GenX (Hexafluoropropylene oxide dimer acid; HFPO-DA) removal efficiency (96.4 %) with superior kinetics (0.399 min−1) and stability. Various characterization results revealed that Cu doping induced a type II heterojunction, facilitating electron transfer from TiO2 to SnO2 and ultimately to Cu2O. Cu(2 %)-SnO2/TiO2 exhibited a unique band structure with a lower conduction band minimum and higher valence band maximum, which suppressed photocorrosion while promoting reactive oxygen species generation, particularly •OH. This was evidenced by the enhanced H2O2 production, increased photocurrent density, and decreased charge recombination, as confirmed by time-resolved photoluminescence analysis. Notably, Cu doping altered the electron transfer pathway, favoring a 3-electron oxygen reduction reaction for efficient •OH production. In situ surface-enhanced Raman spectroscopy analysis revealed dynamic changes in the electronic structure of Cu(2 %)-SnO2/TiO2 upon O2, UV-LED (400 nm), and H2O2 exposure, further supporting the proposed mechanism. These findings demonstrate that Cu doping at optimal levels significantly enhances the photocatalytic activity and stability of SnO2/TiO2 composites for efficient GenX degradation.

Original languageEnglish
Article number166304
JournalChemical Engineering Journal
Volume521
DOIs
StatePublished - 1 Oct 2025

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© 2025 Elsevier B.V.

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