Fundamentals and advantages of ultrafast micro structuring of transparent materials

David Ashkenasi, Arkadi Rosenfeld, Razvan Stoian, Nadya M. Bulgakova, Eleanor E.B. Campbell, Ingolf V. Hertel

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


Time resolved studies using femtosecond laser pulses at 800 nm illuminate the distinctions in the dynamics of ultrafast processing of dielectrics compared to semi-conductors and metals. Dielectric materials are strongly charged at the surface on the sub-ps time scale and undergo an impulsive Coulomb explosion prior to thermal ablation. Provided the laser pulse width remains in the ps or sub-ps time domain this effect can be exploited for processing. Otherwise, the high localization of energy accompanied by ultrafast laser micro structuring is of great advantage also for high quality processing of thin metallic or semi-conductive layers, where the surface charge is effectively quenched.

Original languageEnglish
Pages (from-to)56-62
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Issue numberI
StatePublished - 2002
EventHigh-Power Laser Ablation IV - Taos, United States
Duration: 22 Apr 200226 Apr 2002


  • Ablation processes
  • Coulomb explosion
  • Laser processing
  • Micro structuring
  • Thin films
  • Transparent dielectrics
  • Ultra-short pulses


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