Micro mirror arrays with hidden joint structures (pin and staples) are designed and fabricated. In order to achieve a high fill-factor and to remove the problems caused by elastic spring structures, a joint structure is placed under the mirror plate. All the structural components except the titanium electrode are fabricated with thermally evaporated aluminum. Semi-cured photoresist and thick photoresist are used for sacrificial layers. The static characteristics of the micro mirror are measured by applying a voltage difference between the mirror plate and an address electrode.
|Number of pages||5|
|State||Published - 1997|
|Event||Proceedings of the 1997 IEEE 6th International Conference on Emerging Technologies and Factory Automation, ETFA'97 - Los Angeles, CA, USA|
Duration: 9 Sep 1997 → 12 Sep 1997
|Conference||Proceedings of the 1997 IEEE 6th International Conference on Emerging Technologies and Factory Automation, ETFA'97|
|City||Los Angeles, CA, USA|
|Period||9/09/97 → 12/09/97|