Abstract
Recently, resistive switching random-access memory (ReRAM) has been considered as one of the most promising nonvolatile memory (NVM) technologies, owing to its high scalability, low power consumption, and fast switching speed [1]. In this work, we designed and fabricated Ni/GeOx/p+ Si ReRAM having narrower parameter distribution, robust endurance, and enhanced superiority in Si processing compatibility. Ge has shown wide applications for Si CMOS extension and photonics towards the advanced VLSI [2], and another application for NVM is reported in this work. The process architecture and measurement results are demonstrated, and the annealing effects are investigated.
Original language | English |
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Title of host publication | 2018 76th Device Research Conference, DRC 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Print) | 9781538630280 |
DOIs | |
State | Published - 20 Aug 2018 |
Event | 76th Device Research Conference, DRC 2018 - Santa Barbara, United States Duration: 24 Jun 2018 → 27 Jun 2018 |
Publication series
Name | Device Research Conference - Conference Digest, DRC |
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Volume | 2018-June |
ISSN (Print) | 1548-3770 |
Conference
Conference | 76th Device Research Conference, DRC 2018 |
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Country/Territory | United States |
City | Santa Barbara |
Period | 24/06/18 → 27/06/18 |
Bibliographical note
Funding Information:Acknowledgment This work was supported by a research project of SK hynix, Inc.
Publisher Copyright:
© 2018 IEEE.