Fabrication and characterization of a fully si compatible forming-free GeOxResistive switching random-access memory

Jae Yoon Lee, Youngmin Kim, Ikhyeon Kworn, Il Hwan Cho, Jae Yeon Lee, Soo Gil Kim, Seongjae Cho

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Recently, resistive switching random-access memory (ReRAM) has been considered as one of the most promising nonvolatile memory (NVM) technologies, owing to its high scalability, low power consumption, and fast switching speed [1]. In this work, we designed and fabricated Ni/GeOx/p+ Si ReRAM having narrower parameter distribution, robust endurance, and enhanced superiority in Si processing compatibility. Ge has shown wide applications for Si CMOS extension and photonics towards the advanced VLSI [2], and another application for NVM is reported in this work. The process architecture and measurement results are demonstrated, and the annealing effects are investigated.

Original languageEnglish
Title of host publication2018 76th Device Research Conference, DRC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781538630280
DOIs
StatePublished - 20 Aug 2018
Event76th Device Research Conference, DRC 2018 - Santa Barbara, United States
Duration: 24 Jun 201827 Jun 2018

Publication series

NameDevice Research Conference - Conference Digest, DRC
Volume2018-June
ISSN (Print)1548-3770

Conference

Conference76th Device Research Conference, DRC 2018
Country/TerritoryUnited States
CitySanta Barbara
Period24/06/1827/06/18

Bibliographical note

Funding Information:
Acknowledgment This work was supported by a research project of SK hynix, Inc.

Publisher Copyright:
© 2018 IEEE.

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