Effects of the oxygen vacancy concentration in InGaZnO-based resistance random access memory

  • Moon Seok Kim
  • , Young Hwan Hwang
  • , Sungho Kim
  • , Zheng Guo
  • , Dong Il Moon
  • , Ji Min Choi
  • , Myeong Lok Seol
  • , Byeong Soo Bae
  • , Yang Kyu Choi

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

Abstract

Resistance random access memory (RRAM) composed of stacked aluminum (Al)/InGaZnO(IGZO)/Al is investigated with different gallium concentrations. The stoichiometric ratio (x) of gallium in the InGaxZnO is varied from 0 to 4 for intentional control of the concentration of the oxygen vacancies (VO), which influences the electrical characteristics of the RRAM. No Ga in the IGZO (x=0) significantly increases the value of VO and leads to a breakdown of the IGZO. In contrast, a high Ga concentration (x=4) suppresses the generation of VO; hence, resistive switching is disabled. The optimal value of x is 2. Accordingly, enduring RRAM characteristics are achieved.

Original languageEnglish
Article number243503
JournalApplied Physics Letters
Volume101
Issue number24
DOIs
StatePublished - 10 Dec 2012

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