Abstract
Resistance random access memory (RRAM) composed of stacked aluminum (Al)/InGaZnO(IGZO)/Al is investigated with different gallium concentrations. The stoichiometric ratio (x) of gallium in the InGaxZnO is varied from 0 to 4 for intentional control of the concentration of the oxygen vacancies (VO), which influences the electrical characteristics of the RRAM. No Ga in the IGZO (x=0) significantly increases the value of VO and leads to a breakdown of the IGZO. In contrast, a high Ga concentration (x=4) suppresses the generation of VO; hence, resistive switching is disabled. The optimal value of x is 2. Accordingly, enduring RRAM characteristics are achieved.
Original language | English |
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Article number | 243503 |
Journal | Applied Physics Letters |
Volume | 101 |
Issue number | 24 |
DOIs | |
State | Published - 10 Dec 2012 |