In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.