Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices

Johan Liu; Teng Wang; Wanbing Guan; Michael Olugbenga Olorunyomi; Martin Jönsson; Wen Xuan Wang; Tomas Aronsson; Xiuzhen Lu; Yulai Gao; Qijie Zhai; Eleanor E.B. Campbell; Dongkai Shangguan

Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices

Johan Liu, Teng Wang, Wanbing Guan, Michael Olugbenga Olorunyomi, Martin Jönsson, Wen Xuan Wang, Tomas Aronsson, Xiuzhen Lu, Yulai Gao, Qijie Zhai, Eleanor E.B. Campbell, Dongkai Shangguan

Department of Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.

Original language	English
Title of host publication	IMAPS Nordic Annual Conference 2006
Pages	212-219
Number of pages	8
State	Published - 2006
Event	IMAPS Nordic Annual Conference 2006 - Gothenburg, Sweden Duration: 17 Sep 2006 → 19 Sep 2006

Publication series

Name	IMAPS Nordic Annual Conference 2006

Conference

Conference	IMAPS Nordic Annual Conference 2006
Country/Territory	Sweden
City	Gothenburg
Period	17/09/06 → 19/09/06

Cite this

@inproceedings{f00ad560495b4d6b992807b10d439f28,

title = "Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices",

abstract = "In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.",

author = "Johan Liu and Teng Wang and Wanbing Guan and Olorunyomi, {Michael Olugbenga} and Martin J{\"o}nsson and Wang, {Wen Xuan} and Tomas Aronsson and Xiuzhen Lu and Yulai Gao and Qijie Zhai and Campbell, {Eleanor E.B.} and Dongkai Shangguan",

year = "2006",

language = "English",

isbn = "9781622761821",

series = "IMAPS Nordic Annual Conference 2006",

pages = "212--219",

booktitle = "IMAPS Nordic Annual Conference 2006",

note = "IMAPS Nordic Annual Conference 2006 ; Conference date: 17-09-2006 Through 19-09-2006",

}

Liu, J, Wang, T, Guan, W, Olorunyomi, MO, Jönsson, M, Wang, WX, Aronsson, T, Lu, X, Gao, Y, Zhai, Q, Campbell, EEB & Shangguan, D 2006, Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices. in IMAPS Nordic Annual Conference 2006. IMAPS Nordic Annual Conference 2006, pp. 212-219, IMAPS Nordic Annual Conference 2006, Gothenburg, Sweden, 17/09/06.

TY - GEN

T1 - Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices

AU - Liu, Johan

AU - Wang, Teng

AU - Guan, Wanbing

AU - Olorunyomi, Michael Olugbenga

AU - Jönsson, Martin

AU - Wang, Wen Xuan

AU - Aronsson, Tomas

AU - Lu, Xiuzhen

AU - Gao, Yulai

AU - Zhai, Qijie

AU - Campbell, Eleanor E.B.

AU - Shangguan, Dongkai

PY - 2006

Y1 - 2006

N2 - In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.

AB - In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.

UR - http://www.scopus.com/inward/record.url?scp=84866328331&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84866328331

SN - 9781622761821

T3 - IMAPS Nordic Annual Conference 2006

SP - 212

EP - 219

BT - IMAPS Nordic Annual Conference 2006

T2 - IMAPS Nordic Annual Conference 2006

Y2 - 17 September 2006 through 19 September 2006

ER -

Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices

Abstract

Publication series

Conference

Fingerprint

Cite this