Development of nano-solders, nano thermal interface materials and carbon nanotube based cooling devices

Johan Liu, Teng Wang, Wanbing Guan, Michael Olugbenga Olorunyomi, Martin Jönsson, Wen Xuan Wang, Tomas Aronsson, Xiuzhen Lu, Yulai Gao, Qijie Zhai, Eleanor E.B. Campbell, Dongkai Shangguan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations


In this review paper, some recent achievements on applications in interconnect, die attach and cooling devices based on nanotechnology approach are presented. The applications are specifically addressing: • Development of nano lead free solder alloys for soldering and ACA interconnect • Development of nano thermal interface material for heat removal applications. • Development of cooling devices based on carbon nanotubes on Si-substrate. The paper also presents the driving forces, fundamental ideas behind this technology, the experimental results as well as the theoretical modeling work achieved so far. It is shown that nanotechnology can potentially revolutionize the electronics packaging and production industry to solve the needs of miniaturization, ultra high density packaging and larger power dissipation.

Original languageEnglish
Title of host publicationIMAPS Nordic Annual Conference 2006
Number of pages8
StatePublished - 2006
EventIMAPS Nordic Annual Conference 2006 - Gothenburg, Sweden
Duration: 17 Sep 200619 Sep 2006

Publication series

NameIMAPS Nordic Annual Conference 2006


ConferenceIMAPS Nordic Annual Conference 2006


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