Dependence of device performances on fin dimensions in AlGaN/GaN recessed-gate nanoscale FinFET

  • Gwan Min Yoo
  • , Jae Hwa Seo
  • , Young Jun Yoon
  • , Young Jae Kim
  • , Sung Yoon Kim
  • , Hye Su Kang
  • , Hye Rim Eun
  • , Ra Hee Kwon
  • , Young In Jang
  • , In Man Kang
  • , Seong Min Lee
  • , Seongjae Cho

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In this work, dependence of device performances on AlGaN/GaN heterostructure recessed-gate fin-shaped-channel field-effect transistor (FinFET), as a power transistor, on the fin dimensions is closely investigated. On-state (Ion) and off-state (Ioff) currents are affected by fin geometry and the former showed a more drastic change (250∼1209 mA/mm) compared with the latter (confined to ∼1×10-12 mA/mm order). The design works have been conducted through a three-dimensional (3-D) technology computer-aided design (TCAD).

Original languageEnglish
Title of host publicationISCE 2014 - 18th IEEE International Symposium on Consumer Electronics
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479945924
DOIs
StatePublished - 2014
Event18th IEEE International Symposium on Consumer Electronics, ISCE 2014 - Jeju, Korea, Republic of
Duration: 22 Jun 201425 Jun 2014

Publication series

NameProceedings of the International Symposium on Consumer Electronics, ISCE

Conference

Conference18th IEEE International Symposium on Consumer Electronics, ISCE 2014
Country/TerritoryKorea, Republic of
CityJeju
Period22/06/1425/06/14

Bibliographical note

Funding Information:
Acknowledgement-This work was supported in part by Grant CRL 79-5-482-7 from Institut National de la SantC et de la Recherche MCdicale (INSERM).

Keywords

  • 3-D TCAD
  • FinFET
  • GaN
  • fin design
  • fin-shaped channel
  • heterostructures
  • power transistor
  • recessed gate

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