Abstract
In this work, dependence of device performances on AlGaN/GaN heterostructure recessed-gate fin-shaped-channel field-effect transistor (FinFET), as a power transistor, on the fin dimensions is closely investigated. On-state (Ion) and off-state (Ioff) currents are affected by fin geometry and the former showed a more drastic change (250∼1209 mA/mm) compared with the latter (confined to ∼1×10-12 mA/mm order). The design works have been conducted through a three-dimensional (3-D) technology computer-aided design (TCAD).
Original language | English |
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Title of host publication | ISCE 2014 - 18th IEEE International Symposium on Consumer Electronics |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Print) | 9781479945924 |
DOIs | |
State | Published - 2014 |
Event | 18th IEEE International Symposium on Consumer Electronics, ISCE 2014 - Jeju, Korea, Republic of Duration: 22 Jun 2014 → 25 Jun 2014 |
Publication series
Name | Proceedings of the International Symposium on Consumer Electronics, ISCE |
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Conference
Conference | 18th IEEE International Symposium on Consumer Electronics, ISCE 2014 |
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Country/Territory | Korea, Republic of |
City | Jeju |
Period | 22/06/14 → 25/06/14 |
Bibliographical note
Funding Information:Acknowledgement-This work was supported in part by Grant CRL 79-5-482-7 from Institut National de la SantC et de la Recherche MCdicale (INSERM).
Keywords
- 3-D TCAD
- FinFET
- GaN
- fin design
- fin-shaped channel
- heterostructures
- power transistor
- recessed gate