Abstract
In this letter, electrical and reliability characteristics of diagonally shaped n-channel MOSFETs have been extensively investigated. Compared with the conventional device structure, diagonal MOSFET’s show longer device lifetime under peak Isubcondition (Vg= 0.5Vd). However, in the high gate bias region (Vg = Vd), diagonal MOSFET’s exhibit a significantly higher degradation rate. From the Isubversus gate voltage characteristics, this larger degradation rate under high gate bias is considered to be due mainly to the current-crowding effect at the drain corner. For a cell-transistor operating condition (Vg> Vd), this current-crowding effect in the diagonal transistor can be a serious reliability concern.
| Original language | English |
|---|---|
| Pages (from-to) | 289-291 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 14 |
| Issue number | 6 |
| DOIs | |
| State | Published - Jun 1993 |