Chemical routes to ultra thin films for copper barriers and liners

Engineering

• Thin Films 100%
• Polycrystalline 100%
• Range Order 100%
• Chemical Vapor Deposition 50%
• Vapor Deposition 50%
• Experimental Result 50%
• Ray Photoelectron Spectroscopy 50%
• Single Source 50%
• Growth Condition 50%
• Metallizations 50%
• Alloying 50%
• Crystallinity 50%
• Atomic Layer Deposition 50%
• Growth Mode 50%
• Film Property 50%
• Seed Layer 50%
• High Resolution 50%
• Structural Model 50%
• Dimensional Space 50%
• Diffusion Barrier 50%
• C Content 50%
• Quenching Simulation 50%
• Adhesion Layer 50%
• Bulk Metallic Glass 50%
• Melt Quenching 50%
• Interfacial Energy 50%

Material Science

• Film 100%
• Ultrathin Film 100%
• Ruthenium 66%
• Electrical Resistivity 33%
• Boron 33%
• Amorphous Film 33%
• Chemical Vapor Deposition 16%
• Alloying 16%
• Surface Energy 16%
• X-Ray Photoelectron Spectroscopy 16%
• Medium-Range Order 16%
• Thin Films 16%
• Film Growth 16%
• Short-Range Order 16%

Pharmacology, Toxicology and Pharmaceutical Science

• Boron 10 100%
• Metalloid 100%