TY - GEN
T1 - A unified parallel radix-4 turbo decoder for Mobile WiMAX and 3GPP-LTE
AU - Kim, Ji Hoon
AU - Park, In Cheol
PY - 2009
Y1 - 2009
N2 - This paper describes the energy-efficient implementation of a high performance parallel radix-4 turbo decoder, which is designed to support multiple fourth-generation (4G) wireless communication standards such as Mobile WiMAX and 3GPP-LTE. We propose a new hardware architecture that can share hardware resources for the two standards. It mainly consists of eight retimed radix-4 soft-input soft-output (SISO) decoders to achieve high throughput and a dual-mode parallel hardware interleaver to support both almost regular permutation (ARP) and quadratic polynomial permutation (QPP) interleavers defined in the two standards. A prototype chip supporting both Mobile WiMAX and 3GPP-LTE standards is fabricated in a 0.13μm CMOS technology with eight metal layers. The decoder core occupies 10.7mm2 and can exhibit a decoding rate of more than 100Mb/s with eight iterations while achieving an energy efficiency of 0.31nJ/bit/iter.
AB - This paper describes the energy-efficient implementation of a high performance parallel radix-4 turbo decoder, which is designed to support multiple fourth-generation (4G) wireless communication standards such as Mobile WiMAX and 3GPP-LTE. We propose a new hardware architecture that can share hardware resources for the two standards. It mainly consists of eight retimed radix-4 soft-input soft-output (SISO) decoders to achieve high throughput and a dual-mode parallel hardware interleaver to support both almost regular permutation (ARP) and quadratic polynomial permutation (QPP) interleavers defined in the two standards. A prototype chip supporting both Mobile WiMAX and 3GPP-LTE standards is fabricated in a 0.13μm CMOS technology with eight metal layers. The decoder core occupies 10.7mm2 and can exhibit a decoding rate of more than 100Mb/s with eight iterations while achieving an energy efficiency of 0.31nJ/bit/iter.
UR - http://www.scopus.com/inward/record.url?scp=74049086527&partnerID=8YFLogxK
U2 - 10.1109/CICC.2009.5280790
DO - 10.1109/CICC.2009.5280790
M3 - Conference contribution
AN - SCOPUS:74049086527
SN - 9781424440726
T3 - Proceedings of the Custom Integrated Circuits Conference
SP - 487
EP - 490
BT - 2009 IEEE Custom Integrated Circuits Conference, CICC '09
T2 - 2009 IEEE Custom Integrated Circuits Conference, CICC '09
Y2 - 13 September 2009 through 16 September 2009
ER -