TY - GEN
T1 - A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications
AU - Jeong, Ki Hun
AU - Lee, L. P.
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.
AB - A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.
KW - Biomedical optical imaging
KW - Crystalline materials
KW - Electrostatics
KW - Micromechanical devices
KW - Optical device fabrication
KW - Optical materials
KW - Pistons
KW - Resonant frequency
KW - Temperature
KW - Thermal expansion
UR - http://www.scopus.com/inward/record.url?scp=84944737758&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2003.1217052
DO - 10.1109/SENSOR.2003.1217052
M3 - Conference contribution
AN - SCOPUS:84944737758
T3 - TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
SP - 1462
EP - 1465
BT - TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
Y2 - 8 June 2003 through 12 June 2003
ER -