A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications

Ki Hun Jeong; L. P. Lee

doi:10.1109/SENSOR.2003.1217052

A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications

Ki Hun Jeong, L. P. Lee

Department of Chemistry & Nanoscience

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

10 Scopus citations

Abstract

A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.

Original language	English
Title of host publication	TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1462-1465
Number of pages	4
ISBN (Electronic)	0780377311, 9780780377318
DOIs	https://doi.org/10.1109/SENSOR.2003.1217052
State	Published - 2003
Event	12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States Duration: 8 Jun 2003 → 12 Jun 2003

Publication series

Name	TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume	2

Conference

Conference	12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
Country/Territory	United States
City	Boston
Period	8/06/03 → 12/06/03

Bibliographical note

Publisher Copyright:
© 2003 IEEE.

Keywords

Biomedical optical imaging
Crystalline materials
Electrostatics
Micromechanical devices
Optical device fabrication
Optical materials
Pistons
Resonant frequency
Temperature
Thermal expansion

Access to Document

10.1109/SENSOR.2003.1217052

Cite this

Jeong, K. H., & Lee, L. P. (2003). A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers (pp. 1462-1465). Article 1217052 (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers; Vol. 2). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSOR.2003.1217052

Jeong, Ki Hun ; Lee, L. P. / A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications. TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 1462-1465 (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers).

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title = "A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications",

abstract = "A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.",

keywords = "Biomedical optical imaging, Crystalline materials, Electrostatics, Micromechanical devices, Optical device fabrication, Optical materials, Pistons, Resonant frequency, Temperature, Thermal expansion",

author = "Jeong, {Ki Hun} and Lee, {L. P.}",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers ; Conference date: 08-06-2003 Through 12-06-2003",

year = "2003",

doi = "10.1109/SENSOR.2003.1217052",

language = "English",

series = "TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers",

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Jeong, KH & Lee, LP 2003, A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications. in TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers., 1217052, TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers, vol. 2, Institute of Electrical and Electronics Engineers Inc., pp. 1462-1465, 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers, Boston, United States, 8/06/03. https://doi.org/10.1109/SENSOR.2003.1217052

A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications. / Jeong, Ki Hun; Lee, L. P.
TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2003. p. 1462-1465 1217052 (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

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AU - Jeong, Ki Hun

AU - Lee, L. P.

PY - 2003

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N2 - A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.

AB - A novel method for fabricating a self-aligned electrostatic vertical comb drive using a single layer of a SOI wafer is introduced. The fixed combs are anchored to bimorph cantilevers made of two materials with dissimilar thermal coefficient of expansion, i.e., silicon dioxide and single crystal silicon. The cantilever, which provides the vertical offset between fixed comb and movable comb, is deflected by residual stress during cooling down from oxidation temperature to room temperature. In piston motion, the vertical amplitude at the resonant frequency of 3.5 kHz was 30 μm. In torsional motion, the angle of optical deflection at the resonance of 830 Hz was changed by 6.5°. The measured resonant frequencies correspond to the results form a finite element analysis within 10%. This vertical comb drive is useful for optical and biophotonic MEMS requiring out-of-plane torsional or piston motion.

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KW - Crystalline materials

KW - Electrostatics

KW - Micromechanical devices

KW - Optical device fabrication

KW - Optical materials

KW - Pistons

KW - Resonant frequency

KW - Temperature

KW - Thermal expansion

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DO - 10.1109/SENSOR.2003.1217052

M3 - Conference contribution

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T3 - TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

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EP - 1465

BT - TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers

Y2 - 8 June 2003 through 12 June 2003

ER -

Jeong KH, Lee LP. A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2003. p. 1462-1465. 1217052. (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers). doi: 10.1109/SENSOR.2003.1217052

A novel fabrication method of a vertical comb drive using a single SOI wafer for optical MEMS applications

Abstract

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Bibliographical note

Keywords

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