A Novel 1T DRAM with Shell/Core Dual-Gate Architecture

Md Hasan Raza Ansari, Seongjae Cho

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

This work proposes for the first time that the core-gate (CG) architectures are utilized as stand-alone and embedded capacitorless (one-transistor, 1T) dynamic random-access memory (DRAM) application with high scalability and strengthened high-temperature operation tolerance. The CG 1T DRAM shows the advantages to increase the effective storage area and conduction regions and better capacitive coupling between the shell and the cores gates due to full depletion (forms deeper potential well for storage) of carriers from the Si film, which achieves better performances compared with double-gate (DG) transistor with same device dimension and biasing scheme. Results indicate that proposed 1T DRAM achieves retention time (Tret) of 3.3 s and 0.95 s at 27 °C and 85 °C, respectively, at gate length (Lg) = 100 nm. The device scalability has been proven down to 10 nm with Tret of 25 ms and sensing margin (SM) of 22.76 μA/μm at 85 °C, which ensures the high potential in the embedded DRAM (eDRAM) applications.

Original languageEnglish
Title of host publication2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages90-91
Number of pages2
ISBN (Electronic)9781728142326
DOIs
StatePublished - Aug 2020
Event2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020 - Hsinchu, Taiwan, Province of China
Duration: 10 Aug 202013 Aug 2020

Publication series

Name2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020

Conference

Conference2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020
Country/TerritoryTaiwan, Province of China
CityHsinchu
Period10/08/2013/08/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

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