A low-cost fabrication route for silicon microchannels and microgratings with flow-enabled polymer self-assembly patterning and wet etching

Liyi Li, Bo Li, Zhiqun Lin, Ching Ping Wong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Microchannels and microgratings on silicon (Si) are key components for microfluidic device, microelectromechanical system, Si photonics, micro-chemical reactor, micro-biomedical devices and other applications. In the fabrication flow of these microstructures, photolithography and dry etching are the two major steps. However, both of them incur high fabrication cost. In this paper, we introduce a novel approach for fabrication of Si microstructures. The approach uses flow-enabled polymer self-assembly (FESA) as a facile pattern formation method on Si surface; a novel wet etching method, named metal-assisted chemical etching, is employed for Si etching. These two consecutive steps show good compatibility with each other and capability of uniform microstructures fabrication on Si. The proposed approach, with combination of two low-cost yet high-performance novel technology, will serve as a promising route for microchannels and microgratings fabrication for various Si-related devices in high-volume production.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2149-2154
Number of pages6
ISBN (Electronic)9781479986095
DOIs
StatePublished - 15 Jul 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 26 May 201529 May 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Conference

Conference2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Country/TerritoryUnited States
CitySan Diego
Period26/05/1529/05/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

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