Abstract
Microchannels and microgratings on silicon (Si) are key components for microfluidic device, microelectromechanical system, Si photonics, micro-chemical reactor, micro-biomedical devices and other applications. In the fabrication flow of these microstructures, photolithography and dry etching are the two major steps. However, both of them incur high fabrication cost. In this paper, we introduce a novel approach for fabrication of Si microstructures. The approach uses flow-enabled polymer self-assembly (FESA) as a facile pattern formation method on Si surface; a novel wet etching method, named metal-assisted chemical etching, is employed for Si etching. These two consecutive steps show good compatibility with each other and capability of uniform microstructures fabrication on Si. The proposed approach, with combination of two low-cost yet high-performance novel technology, will serve as a promising route for microchannels and microgratings fabrication for various Si-related devices in high-volume production.
Original language | English |
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Title of host publication | 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 2149-2154 |
Number of pages | 6 |
ISBN (Electronic) | 9781479986095 |
DOIs | |
State | Published - 15 Jul 2015 |
Event | 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States Duration: 26 May 2015 → 29 May 2015 |
Publication series
Name | Proceedings - Electronic Components and Technology Conference |
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Volume | 2015-July |
ISSN (Print) | 0569-5503 |
Conference
Conference | 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 |
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Country/Territory | United States |
City | San Diego |
Period | 26/05/15 → 29/05/15 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.