TY - GEN
T1 - A low-cost fabrication route for silicon microchannels and microgratings with flow-enabled polymer self-assembly patterning and wet etching
AU - Li, Liyi
AU - Li, Bo
AU - Lin, Zhiqun
AU - Wong, Ching Ping
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/15
Y1 - 2015/7/15
N2 - Microchannels and microgratings on silicon (Si) are key components for microfluidic device, microelectromechanical system, Si photonics, micro-chemical reactor, micro-biomedical devices and other applications. In the fabrication flow of these microstructures, photolithography and dry etching are the two major steps. However, both of them incur high fabrication cost. In this paper, we introduce a novel approach for fabrication of Si microstructures. The approach uses flow-enabled polymer self-assembly (FESA) as a facile pattern formation method on Si surface; a novel wet etching method, named metal-assisted chemical etching, is employed for Si etching. These two consecutive steps show good compatibility with each other and capability of uniform microstructures fabrication on Si. The proposed approach, with combination of two low-cost yet high-performance novel technology, will serve as a promising route for microchannels and microgratings fabrication for various Si-related devices in high-volume production.
AB - Microchannels and microgratings on silicon (Si) are key components for microfluidic device, microelectromechanical system, Si photonics, micro-chemical reactor, micro-biomedical devices and other applications. In the fabrication flow of these microstructures, photolithography and dry etching are the two major steps. However, both of them incur high fabrication cost. In this paper, we introduce a novel approach for fabrication of Si microstructures. The approach uses flow-enabled polymer self-assembly (FESA) as a facile pattern formation method on Si surface; a novel wet etching method, named metal-assisted chemical etching, is employed for Si etching. These two consecutive steps show good compatibility with each other and capability of uniform microstructures fabrication on Si. The proposed approach, with combination of two low-cost yet high-performance novel technology, will serve as a promising route for microchannels and microgratings fabrication for various Si-related devices in high-volume production.
UR - http://www.scopus.com/inward/record.url?scp=84942108245&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2015.7159900
DO - 10.1109/ECTC.2015.7159900
M3 - Conference contribution
AN - SCOPUS:84942108245
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2149
EP - 2154
BT - 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Y2 - 26 May 2015 through 29 May 2015
ER -