Abstract
The conduction mechanism and resistive switching properties in a resistive-random-access-memory device composed of Al(top)/TiO x/TiO 2/Al(bottom) are investigated in this paper. The active-top-electrode (TE) material aluminum interacted with the TiO 2 layer and induced an oxygen-deficient TiOx layer near the TE. The naturally formed oxygen-deficient TiOx layer was confirmed by a transmission-electron- microscope energydispersive X-ray spectrometry analysis. The oxygen-deficient TiOx region acted as a trap for electrons and contributed to the resistive switching. The proposed mechanism and measured data are verified through simulation of a two-variable resistor model.
Original language | English |
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Article number | 5306148 |
Pages (from-to) | 3049-3054 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 56 |
Issue number | 12 |
DOIs | |
State | Published - Dec 2009 |
Keywords
- Oxygen vacancy
- Resistive random access memory (RRAM)
- Resistive switching
- TiO