TY - GEN
T1 - 3D printed biaxial scanning micromirror for biomedical applications
AU - Hwang, Jeong Yeon
AU - Ji, Chang Hyeon
N1 - Funding Information:
This work was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF-2017R1A2B4007830), and by the EU Framework program of the National Research Foundation (NRF) funded by the Ministry of Science, ICT & Future Planning (2014K1B1A1073720).
Publisher Copyright:
© 2020 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - This paper presents a new type of biaxial scanning micromirror fabricated with 3D printing technology. The fabricated device is electromagnetically actuated with external coils and moving magnets embedded in the structural layer of the device. With the fabricated device, the maximum optical scan angle of 11 degrees and 10.3 degrees have been obtained for vertical and horizontal scan modes, respectively. Proposed scanning micromirror design and fabrication approach using 3D printing can be utilized in various applications, including biomedical imaging systems with further device optimization.
AB - This paper presents a new type of biaxial scanning micromirror fabricated with 3D printing technology. The fabricated device is electromagnetically actuated with external coils and moving magnets embedded in the structural layer of the device. With the fabricated device, the maximum optical scan angle of 11 degrees and 10.3 degrees have been obtained for vertical and horizontal scan modes, respectively. Proposed scanning micromirror design and fabrication approach using 3D printing can be utilized in various applications, including biomedical imaging systems with further device optimization.
KW - 3D printing
KW - Biomedical imaging
KW - Electromagnetic actuation
KW - Scanning micromirror
UR - http://www.scopus.com/inward/record.url?scp=85083491723&partnerID=8YFLogxK
U2 - 10.1109/ICEIC49074.2020.9051197
DO - 10.1109/ICEIC49074.2020.9051197
M3 - Conference contribution
AN - SCOPUS:85083491723
T3 - 2020 International Conference on Electronics, Information, and Communication, ICEIC 2020
BT - 2020 International Conference on Electronics, Information, and Communication, ICEIC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 International Conference on Electronics, Information, and Communication, ICEIC 2020
Y2 - 19 January 2020 through 22 January 2020
ER -